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Manufacturing Press Releases

2020-10-23 15:36 Smiths Detection Inc. receives a $90.8M IDIQ contract to manufacture Joint Chemical Agent Detector Adapter for US Department of Defense
2020-10-23 13:23 Titomic to Supply Aerospace Tooling to Hockley Pattern & Tool
2020-10-23 13:20 ABB: Q3 2020 Results
2020-10-23 12:51 Toshiba Launches Dual H-bridge Motor Driver IC With PWM Control for Mobile Devices and Home Appliances
2020-10-22 18:52 Eaton Launches New Metal 3D Printing Program to Reduce Development Time, Improve Efficiency
2020-10-22 16:34 Additive Manufacturer Green Trade Association Announces New Members
2020-10-22 16:27 Bacardi First in Fight Against Plastic Pollution With 100% Biodegradable Spirits Bottle
2020-10-22 16:17 Plastic Transformation Simulation to Take the Augmented Reality to a New Level Thanks to The AMPLI Project
2020-10-21 13:11 uAvionix Files FAA TSO Application for World’s First Certified Drone Transponder
2020-10-21 10:09 Shell Deepwater Selects Bentley’s iTwin Platform for Project Delivery
2020-10-20 14:24 Toshiba Launches 1200V Silicon Carbide MOSFET That Contributes to High-efficiency Power Supply
2020-10-20 09:51 Bentley Systems announces Executive Appointments of Nicholas Cumins (Chief Product Officer), Katriona Lord-Levins (Chief Success Officer), and Chris Bradshaw (Chief Marketing Officer)
2020-10-19 18:33 Raysut Maldives Cement JV Formed; Acquisition of LafargeHolcim Stake Completed
2020-10-19 09:23 ISA TanTec To Launch COSM (Creation of Sustainable Materials) Division
2020-10-16 18:08 Eaton’s Vehicle Group Facilities Aim to Minimize Environmental Impact With New Technologies and Systems
2020-10-16 11:31 ESI Group Won the COVID-19 Prize of “L’Usine Digitale Simulation and AI Awards”
2020-10-16 10:20 Seoul Semiconductor’s New Generation ‘WICOP’ Technology Brings Innovation to Electric Vehicle Headlamps
2020-10-15 18:59 actnano, the Global Leader in Protective Nanocoatings for Automotive & Consumer Electronics, Raises an Oversubscribed $12M Series A Round
2020-10-15 13:09 Showa Denko Materials’ Low Transmission Loss Printed Wiring Board Material “MCL-LW-900G/910G” Adopted for the Printed Wiring Boards of the World’s No. 1*1 Supercomputer, “Fugaku”
2020-10-14 15:31 AGCO Announces Chief Communication Officer Transition

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