CHANDLER, Ariz--(BUSINESS WIRE)--Amkor Technology, Inc. (Nasdaq: AMKR), a leading provider of semiconductor packaging and test services, today announced that it has received the 2013 Excellent Service Provider Award from Semiconductor Manufacturing International Corporation (SMIC), the third consecutive year Amkor has earned this award. Mr. TH Chen, SMIC’s Vice President of Corporate Planning Center, presented the award to Amkor at a ceremony held at Amkor’s Shanghai, China facilities.
“We are honored to receive SMIC’s Excellent Service Provider Award for the third consecutive year,” said Gilbert Zhou, Amkor Assembly and Test (Shanghai) Co., Ltd president and China country manager. “This award is a testament to the hard work of our team in Amkor Technology China, and our commitment and ability to support and provide value to our customers.”
SMIC presents its Excellent Service Provider Awards to its top ranking suppliers each year. The criteria evaluated in choosing the award recipients include quality, price, on-time delivery, technical support, logistics and customer service. Amkor provides SMIC with 200mm wafer bumping and full turn-key wafer-level CSP services, including probe, 200mm wafer bumping and die processing services.
About Amkor
Amkor is a leading provider of semiconductor packaging and test services to semiconductor companies and electronics OEMs. More information on Amkor is available from the company's SEC filings and at Amkor's website: www.amkor.com.