SANTA CLARA, Calif.--(BUSINESS WIRE)--eASIC Corporation, (@easic) a fabless semiconductor company that delivers a custom integrated circuit (IC) platform (eASIC Platform), today announced that it has shipped over twenty million custom ICs. eASIC custom ICs are used by electronics companies that need the right combination of fast time to market, high performance and low power consumption, in a cost effective and customizable solution that enables high volume production. Examples of where eASIC solutions are used include NAND based storage systems, wireless infrastructure equipment including digital front end applications for 3G and LTE, microwave backhaul solutions and wired communications equipment.
“This milestone demonstrates that the eASIC solution continues to be an attractive alternative to traditional ASICs or FPGAs. Increased adoption in both infrastructure equipment and end user applications indicate that our scalable eASIC IC solution can be customized and built quickly at a cost structure that enables both fast time to market and high volume production”, said Jasbinder Bhoot, Vice President of Worldwide Marketing at eASIC. “eASIC’s latest generation platform, the eASIC Nextreme-3, was released to production six months ago and we believe this generation of platform delivers the increased serial bandwidth, higher performance logic, and lower power consumption that customers need to continue to develop differentiated products.”
“For new designs, equipment companies must consider several trade-offs before deciding which type of device (FPGA, ASIC or ASSP) to choose for their specific application”, said Michele Reitz, Principal Research Analyst for Semiconductors at Gartner. “The main downsides of FPGAs compared with other options are in high-volume, high-performance and low-cost applications. These are requirements better suited to the leading-edge ASICs and ASSPs available in the market.”1
About eASIC Corporation
eASIC is a semiconductor company offering a differentiated solution that enables us to rapidly and cost-effectively deliver custom ICs, creating value for our customers’ hardware and software systems. Our eASIC solution consists of our eASIC platform which incorporates a versatile, pre-defined and reusable base array and customizable single-mask layer, our ASICs, delivered using either our easicopy or standard ASIC methodologies, and our proprietary design tools. We believe this innovative technology allows eASIC to offer the optimal combination of fast time-to-market, high performance, low power consumption, low development cost and low unit cost for our customers. eASIC Corporation is headquartered in Santa Clara, California. Investors include Khosla Ventures, Crescendo Ventures, Seagate Technology, Kleiner Perkins Caufield and Byers (KPCB) and Evergreen Partners.
1 Gartner, Competitive Landscape: FPGA Vendors Closing in on ASICs, ASSPs, the IoT and Security as Chip Costs Rise, 2014, Michele Reitz, 21 October 2014.