TAIPEI, Taiwan--(BUSINESS WIRE)--Advanced Semiconductor Engineering, Inc (TAIEX: 2311, NYSE: ASX), the world’s largest semiconductor assembly and test service provider, today announced it will be showcasing its System in Package (SiP) solutions in consumer and automotive applications at SEMICON China, scheduled to take place in Shanghai, China, from March 15 to 17, 2016. These SiP applications leverage on the synergy between ASE’s IC packaging, material and test technologies, with the manufacturing expertise of our electronic manufacturing services in module level packaging to bring SiP into the realm of the Internet-of-Things (IoT).
SiP technology enables multiple semiconductor chips and passive components to be integrated within a smaller and more compact module without compromising the functionality and performance of the entire package or module. Hence, SiP can be ideally applied to many of today’s consumer technologies that require heterogeneous integration of numerous IC functions such as RF, processor, memory, sensors, power management, multimedia, and more, within very tight space constraints.
To better serve the fast-growing IoT segment, ASE has evolved its business model by combining its technologies in wire bonding, wafer level, fan-out, flip chip, 2.5D/3D, substrates and embedded IC packaging with USI’s module level assembly to establish a strong leadership in SiP. ASE has also created a cohesive ecosystem for its SiP platform that included a key announcement with Inotera Memories Inc (April 7, 2014) on foundry service for 2.5D silicon interposer and TDK Corporation (May 8, 2015) for proprietary embedded substrate manufacturing. The collaboration within the supply chain has led to the development of a world class manufacturing technology that can be used in embedded solutions within smartphones, wearables, homes, connectivity and sensor applications.
SEMICON China is organized by SEMI, a global industry association serving companies that provide equipment materials and services used to manufacture semiconductors, displays, nano-scaled structures, micro-electromechanical systems (MEMS), photovoltaic and related technologies. The ASE Group supports SEMICON shows worldwide and the Shanghai event is one of the most important program on the company’s industry event calendar.
Attendees at SEMICON China will be able to learn more about ASE’s technology offerings at the Shanghai New International Expo Center, hall N5, booth number 5431, from 9.00 am to 5.00 pm. The exhibits on display will include mesh lighting (smart lighting) that can be controlled through an iPad, environmental sensors, logistics and M2M tracking using 4G LTE SiP, mobile connectivity in cars, wearables and ASE’s advanced packaging technology portfolio. Attendees will have the opportunity to see how SiP solutions are implemented into a variety of applications, including smart living, automotive communications and electronics, data management and diagnostic devices in healthcare.
About ASE Group
Advanced Semiconductor Engineering, Inc. (ASE Group) is the world’s largest provider of independent semiconductor manufacturing services in assembly, test, materials and design manufacturing. As a global leader geared toward meeting the industry’s ever-growing needs for faster, smaller and higher performance chips, ASE develops and offers a wide portfolio of technology and solutions including IC test program design, front-end engineering test, wafer probe, wafer bump, substrate design and supply, wafer level package, flip chip, SiP, final test and electronic manufacturing services through USI Inc. and its subsidiaries, members of ASE Group. ASE generated sales revenues of US $8.64 billion in 2015 and employs over 65,000 people worldwide. For more information about ASE Group, visit www.aseglobal.com.