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GSA Memory Conference to Focus on Bridging Memory and Logic ICS for a Better System Performance

2010-03-12 10:05
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GSA Memory Conference 2010

TAIPEI, Taiwan--(BUSINESS WIRE)--The GSA Memory Conference will be held on March 16, 2010 at the Grand Formosa Regent in Taipei, Taiwan.

Welcome remarks from Jodi Shelton, president, GSA; Dr. Nicky Lu, GSA board chairman, and chairman and chief executive officer, Etron Technology, Inc.; and Dr. Chih-Yuan Lu, chairman, IC Industry Committee, Chinese Institute of Electrical Engineering (CIEE) and president, Macronix International Co., Ltd. will initiate a full day of presentations.

“In addition to Moore’s Law, the emerging era of Heterogeneous Integrated System Chips leads innovation power and corporate growth, especially due to synergy of logic and memory integration. GSA takes the leading role to provide business platforms to enhance Clusters with Virtual Vertical Integration for semiconductor players,” stated Dr. Nicky Lu, GSA board chairman. “The close linkage of memory IC with logic IC will largely and cost effectively enhance the performance of system applications, thus brings lots of benefit to the end customers in human society,” said Dr. Chih-Yuan Lu, GSA Memory Committee Chair.

The educational program will address “Bridging Memory and Logic ICs for a Better System Performance” from distinguished keynotes and featured speakers:

  • Mark Brillhart, vice president of Quality and Technology, Cisco Systems, Inc.
    “High Performance System-in-Package (SiP) for Networking Products”
  • Edward Doller, corporate vice president and chief technology officer, Numonyx
    “Forging a Future in Memory: New Technologies, New Markets, New Applications”
  • Pierre C. Fazan, chief technology officer, founder, Innovative Silicon
    “Future RAM Emerging Memory Technologies and Their Applications”
  • Dr. Subramanian Iyer, IBM chief technologist, Semiconductor Research and Development Center, IBM
    “High Performance Embedded Memory and Memory Hierarchy in High End Systems”
  • Dr. Oh-Hyun Kwon, president of the Semiconductor Business, Samsung Electronics Co., Ltd.
    “Value-driven Memory Technology for the Future Semiconductor Market”
  • Dr. Rich Liu, Chief Scientist, Macronix International Co., Ltd.
    “Future Trends and Challenges of Flash Memory Technology”
  • Frank A.Y. Wang, executive director, Morgan Stanley Taiwan Ltd.
    “Global Memory Industry: Perspective and Progress”
  • Dr. Drew E. Wingard, co-founder and chief technology officer, Sonics, Inc.
    “Eliminating DRAM Performance Bottlenecks in Embedded SoCs”

The platinum sponsor for this event is TSMC and Gold sponsors include ASE Group, Macronix International Co., Ltd, Phison Electronics and Sonics, Inc. The collaborators of this event are ITRI and TSIA.

Registration for the GSA Memory Conference is complimentary for GSA and CIEE Members and NT$3,000 for non-members. Please sign up online by March 15, 2010. For additional information, please visit http://www.gsaglobal.org/events/2010/0316/index.asp.

About GSA

The Global Semiconductor Alliance (GSA) mission is to accelerate the growth and increase the return on invested capital of the global semiconductor industry by fostering a more effective fabless ecosystem through collaboration, integration and innovation. It addresses the challenges within the supply chain including IP, EDA/design, wafer manufacturing, test and packaging to enable industry-wide solutions. Providing a platform for meaningful global collaboration, the Alliance identifies and articulates market opportunities, encourages and supports entrepreneurship, and provides members with comprehensive and unique market intelligence. Members include companies throughout the supply chain representing 25 countries across the globe. www.gsaglobal.org

 

Contacts

GSA Asia Pacific Contact:
Amber Mo, 886-2-8712-8661 ext. 11
Marketing Manager
amo@gsaglobal.org
or
GSA U.S. Contact:
Nicole Bowman, 972-866-7579 ext. 129
Senior Marketing Manager
nbowman@gsaglobal.org