USB-IF Member Companies Converge in Taipei to Exhibit New Consumer Products at SuperSpeed USB Developers Conference

TAIPEI, Taiwan--(BUSINESS WIRE)--Today at the SuperSpeed USB Developers Conference in Taipei, the USB Implementers Forum (USB-IF) announced the certification of 75 SuperSpeed USB products and multiple company demonstrations of new SuperSpeed USB consumer products, furthering industry momentum for the technology. Certified SuperSpeed USB products from industry-leading companies are available to consumers worldwide. Additionally, SuperSpeed USB products in new device classes, from display to hubs, are emerging.

“SuperSpeed USB momentum continues to explode, with new products rapidly entering the market, furthering the expansion of the SuperSpeed USB ecosystem,” said Jeff Ravencraft, president and chairman, USB-IF. “Providing our members the opportunity to gather information and insights is a key function of our SuperSpeed USB Developers Conferences. I am pleased to be in Taipei this week to share the benefits of SuperSpeed USB with the industry at large.”

“SuperSpeed USB is tracking with IDC’s forecast from last year for its adoption,” said Shane Rau, director of IDC’s Computing and Storage Semiconductors research. “Driven by the need for more and faster data storage capabilities in PCs, we continue to forecast that SuperSpeed USB will ship in 45 percent of mobile PCs in 2012.”

SuperSpeed USB enables new use cases and enhances existing devices due to the incredible transfer speeds that the technology is capable of achieving. The speed supplied by SuperSpeed USB allows technological advancements such as being able to drive two or more displays at full 1080p resolution while simultaneously reading data from external disk drives. The use case, showcased today at the conference, featured a SuperSpeed USB notebook computer reading content from a SuperSpeed USB hard disk drive and simultaneously outputting the video content to two HD displays. In addition, the availability of SuperSpeed USB hubs will enable new device classes, including monitors and printers with SuperSpeed USB hubs incorporated in the devices.

The SuperSpeed USB Developers Conference offers attendees the opportunity to hear directly from the creators of the USB 3.0 specification and receive a comprehensive SuperSpeed USB update. This year’s keynote speakers include:

• Jeff Ravencraft, president and chairman, USB-IF
• Lee Atkinson, distinguished technologist in the consumer notebook group, HP
• Tony Chen, vice president and vice chair of system business group, ASUSTek Computer Inc.
• Henry Kao, vice president of GIGABYTE Motherboard Business unit, GIGABYTE

Following closely behind the USB-IF’s second Asia Pacific SuperSpeed USB Developers Conference will be the first USB-IF workshop offering SuperSpeed USB certification of peripherals and peripheral silicon. The certification workshop will take place in Portland, Oregon, April 26-30, 2010. The event will provide companies the opportunity to certify their SuperSpeed USB devices, allowing the device to bear the SuperSpeed USB certified logo. A mark of quality to both manufacturers and consumers, the certification logo is an indicator to consumers that devices will work out of the box, interoperating with the entire ecosystem of USB systems and devices. To learn more about the Certification and Compliance program and submit products and devices for testing and certification, visit http://www.usb.org/developers/compliance/.

About the USB-IF

The non-profit USB Implementers Forum, Inc. was formed to provide a support organization and forum for the advancement and adoption of USB technology. The USB-IF facilitates the development of high-quality, compatible USB devices through its logo and compliance program and promotes the benefits of USB and the quality of products that have passed compliance testing. Further information, including postings of the most recent product and technology announcements, is available by visiting the USB-IF Web site at www.usb.org.

The names of actual companies and products mentioned herein may be the trademarks of their respective owners.