TOKYO--(BUSINESS WIRE)--Toshiba Corporation’s (TOKYO:6502) Semiconductor & Storage Products Company today announced that it will start from today, sample shipments of 32-gigabyte and 64-gigabyte (GB) embedded NAND flash memory modules compliant with the JEDEC UFS[1] Ver.2.0 standard, the first company in the industry[2] to do so. The modules also integrate 5.8Gbps High-speed MIPI® M-PHY®[3] HS-G3 I/F, which is an optional feature of the UFS Ver. 2.0 standard, and achieve ultra-high performance, including 650MB/s read speed and 180MB/s write speed.
The faster transfer speeds can shorten the time taken to launch many kinds of applications, shoot digital still images, and play and download large data movie and music files on mobile products like smartphones or tablet PCs.
Demand continues to grow for large density, high-performance chips that support high resolution video, driven by improved data-processing speeds in host chipsets and wider bandwidths for wireless connectivity in a wide range of digital consumer products, including smartphones and tablet PCs.
Toshiba has proved itself an innovator in this key area, and is now reinforcing its leadership by being first in the industry to deliver samples with a high performance UFS module.
Toshiba will schedule mass production and add other densities to the line-up in response to market demand.
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Outline of New Products |
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| Part Number | Density | Package | ||
| THGLF2G8C4KBADR | 32GB |
153Ball FBGA
11.5x13x1.0mm |
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| THGLF2G9C8KBADG | 64GB |
153Ball FBGA
11.5x13x1.2mm |
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Key Features
- The JEDEC UFS Ver.2.0 compliant interface handles essential functions, including writing block management, error correction and driver software. It simplifies system development, allowing manufacturers to minimize development costs and speed up time to market for new and upgraded products.
- The product has ultra-high read/write performance and the maximum transfer rate of this product is up to 11.6Gbps by supporting 2 lane MIPI M-PHY HS-G3 I/F, which is an optional feature of UFS Ver. 2.0.
- The new products are sealed in a small FBGA package and have a signal layout compliant with JEDEC UFS Ver.2.0.
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Key Specifications |
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| Interface | JEDEC UFS Version 2.0 standard | |
| Power Supply Voltage |
2.7V to 3.6V (Memory core）
1.70V to 1.95V （Memory interface, etc.） 1.10V to 1.30V (Controller core, UFS I/F signals) |
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| Number of lane | Downstream 2lane / Upstream 2lane | |
| I/F Speed | 5.8Gbps/lane | |
| Temperature range | -25degress to +85degrees Celsius | |
| Package |
153Ball FBGA
11.5x13x1.0mm (32GB) / 11.5x13x1.2mm (64GB) |
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Notes: |
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[1] |
Universal Flash Storage is a product category for a class of embedded memory products built to the JEDEC UFS standard specification. | |
| [2] |
For embedded NAND flash memory modules, as of April 25, 2014. Toshiba survey. |
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| [3] | MIPI® and M-PHY® are trademarks, servicemarks, registered trademarks, and/or registered servicemarks owned by MIPI Alliance. | |
Customer Inquiries:
Memory Marketing Division
Tel: +81-3-3457-3401
Information in this document, including product prices and specifications, content of services and contact information, is current on the date of the announcement but is subject to change without prior notice.
About Toshiba
Toshiba is a world-leading diversified manufacturer, solutions provider and marketer of advanced electronic and electrical products and systems. Toshiba Group brings innovation and imagination to a wide range of businesses: digital products, including LCD TVs, notebook PCs, retail solutions and MFPs; electronic devices, including semiconductors, storage products and materials; industrial and social infrastructure systems, including power generation systems, smart community solutions, medical systems and escalators & elevators; and home appliances.
Toshiba was founded in 1875, and today operates a global network of more than 590 consolidated companies, with 206,000 employees worldwide and annual sales surpassing 5.8 trillion yen (US$61 billion). Visit Toshiba's web site at www.toshiba.co.jp/index.htm
