Hall N2 #2655 – Total Process Control for Wafer Fabrication and Advanced Packaging
Rudolph will highlight total process control for semiconductor manufacturing and advanced packaging, with solutions for integrated defect inspection and metrology; defect analysis, classification and review; and lithography, including:
- Truebump™ Technology on the Dragonfly™ Inspection System - fast, accurate and repeatable three-dimensional (3D) metrology for all advanced packaging bumping applications, from copper (Cu) pillar, to microbumps, and even large C4 bumps.
- Clearfind™ Technology on the Firefly™ Inspection System - detects defects that are almost impossible to find using conventional imaging techniques – helping to significantly reduce yield-robbing failures in both front- and back-end manufacturing processes.
- Yield analysis, data management and defect classification software - critical to controlling and improving yield.
- JetStep Lithography Systems - a revolutionary exposure tool specifically-designed to meet advanced packaging challenges, including the ability to handle a variety of substrate shapes and sizes.
In addition, Rudolph’s Director of Technology Development and Applications, Priya Mukundhan will present, “Monitoring Critical Process Steps in 3D NAND and Advanced RF using Picosecond Ultrasonic Metrology,” at the China Semiconductor Technology International Conference (CSTIC), Symposium VI: Metrology, Reliability and Testing, on 12 March.
Hall N2 #2381 – Probe Card Test & Analysis for Semiconductor Devices
Automated probe card test and repair is used to monitor probe card health to ensure cards are ready and capable of testing semiconductor devices. Rudolph’s systems can measure critical card metrics, such as tip position, tip size, tip planarity, contact resistance, and electrical continuity.
Hall N1 #1213 – Lithography for Display Manufacturing
Featured products for flat panel display manufacturing include the JetStep® G45 lithography system, fab-wide yield management software for intelligent diagnostics, fab-wide fault detection and classification software and automatic defect classification. Rudolph’s Vice President of Business Development, Elvino da Silveira, will present, “A Novel Lithography Approach to Overcome the Next Generation Flexible AMOLED Production Challenges” at the 2018 China Display Conference Emerging Display Forum on 14 March.
“Consumer demand for high-quality displays is driving rapid adoption of AMOLED and creating new manufacturing challenges as the industry works to increase production,” said da Silveira. “We will present our novel lithography solution for AMOLED panels, which reduces tooling cost and operating expenses, resulting in superior value of ownership for the customer.”
For more information about Rudolph’s total process control and lithography solutions, visit www.rudolphtech.com.
About Rudolph Technologies
Rudolph Technologies, Inc. is a leader in the design, development, manufacture and support of defect inspection, lithography, process control metrology, and process control software used by semiconductor and advanced packaging device manufacturers worldwide. Rudolph delivers comprehensive solutions throughout the fab with its families of proprietary products that provide critical yield-enhancing information, enabling microelectronic device manufacturers to drive down costs and time to market of their devices. Headquartered in Wilmington, Massachusetts, Rudolph supports its customers with a worldwide sales and service organization. Additional information can be found on the Company’s website at www.rudolphtech.com.